The global AI boom is driving enterprises to deploy AI/GPU servers for tasks ranging from model training to inference. However, the high power and advanced cooling requirements of these servers often exceed the capabilities of most enterprise data centers, posing a significant hurdle for many businesses. Recognizing this critical challenge, Chief Telecom has launched Taiwan’s premier AI infrastructure ready-to-use liquid-cooled solution. This offering provides enterprises with high-performance computing data centers specifically engineered for AI applications.
Chief Telecom’s LY2 AI Data Center is engineered to meet the stringent demands of AI workloads with a liquid-cooled solution supporting 80kW to 150kW per rack. Designed with green building principles and seismic isolation, LY2 IDC delivers “three high” advantages：
- High Power: Supports demanding power requirements from 10kW to 150kW.
- High Floor Load Capacity: Features a floor loading capacity of 2000 kg/m².
- High Cooling: Adopts an advanced liquid-cooled solution for superior heat dissipation.
Liquid-Cooling-System
These features comprehensively address the weight and operational stability requirements of AI servers. Beyond its physical infrastructure, LY2 enhances AI operations through direct connections to five major public clouds and complete domestic and international network resources and submarine cables, facilitating seamless access to global cloud resources.
Beyond its advancements in AI data centers, Chief Telecom also operates TPIX (Taipei Internet Exchange), as the largest Internet Exchange center in Taiwan and ranked 68th globally. TPIX, currently with over 200 members and international nodes in Japan, Hong Kong, and Singapore, plans further expansion into the United States and Europe, with the goal of becoming a top 50 globally and the top 3 IXP in Asia.
Chief Telecom is building more than just an AI data center; we’re creating a comprehensive infrastructure ecosystem that empowers businesses to immediately launch AI applications and drive rapid innovation.
Fan-Wall
